Dear MEMS Researchers,
        I work in the R&D department of a company called RODEL (Newark,
Delaware, USA) and am actively involved in the development of
consumables for Chemical Mechanical Polishing (CMP).  Although CMP is
extensively used in semiconductor processing, I have not seen too much
discussion related to CMP in the MEMS community.  For achieving global
planarity (and precision surfaces), CMP has been widely accepted as an
alternative to RIE (etching).
        I believe that there is good potential of incorporating CMP in
MEMS processing as well, especially in the area of surface
micromachining.  I am trying to get insight and suggestions from the
MEMS researchers (and eventually mutually benefit) on how I can develop
different CMP consumables and applications for MEMS processing.  We
provide polishing consumables (slurry and pad) for several selective
materials, such as silicon, silicon oxide, aluminum, copper, tungsten,
etc.
Please feel free to contact me for further technical discussions and
areas of cooperation.
Thanks very much,

Vikas Sachan, Ph.D.
RODEL Research
Tel: 302-366-0500/ext. 2539
e-mail: vsachan@rodel.com