Dear all,
  We are currently working on Temperature sensor
simulated using MEMsPro (AMI technology) .  However
when we sent it to MOSIS to know further info on the
following they said that they currently do not support
universities.  However, we currently need the
following info to simulate the sensor:
 wafer thickness:
> bulk etch- the depth:
the angle:
the undercut:
oxide thickness:
metal thickness:



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