I think you can try to etch a trench for your epoxy when you are etching you
micochannel so that the contact between quartz substrate and glass slide
will be more close. I did that.

Xi

-----Original Message-----
From: mems greenhorn
To: mems-talk@memsnet.org
Sent: 6/18/2003 1:01 PM
Subject: [mems-talk] bonding

I have a microchannel etched on a quartz substrate ..the chip size is
1cm x 3cm with gold layer on it which was a masking layer during the
glass etch.For the capping wafer I am using a microscope glass slide. At
present I use epoxy at the edges to bond the glass slide to  the
chip.There is no leakage out of the channel this way.But at the
interface i.e at area of contact between the surface of the chip and the
top slide some liquid seeps in.Is there any simple solution to prevent
this ?


---------------------------------
Do you Yahoo!?
SBC Yahoo! DSL - Now only $29.95 per month!
_______________________________________________
MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.memsnet.org/