Hi Raj,
the 620C 2um poly recipe will most likely give you
a highly compressive poly several Hundred MPa in
value. For Low stress Poly you will need to grow
it at 580-600C closer to the amorphous-crystalline
phase transition temperature. The unit cell volume
change during the as-growth phase transformation will
give you a low tensile stress film.

cheers

Dave Kharas Ph.D.
Sarcon Microsystems
dave_kharas@yahoo.com

> Dear Friends
    We are in the process of validating our film
stress data. Can
anybody
suggest us the typical stress range of the following
films.


Dep. Method     Film Type       Thick.      Dep. Temp.
LPCVD           Polysilicon     20000 A     620 Deg. C
PECVD           Nitride         10000 A     400 Deg. C
LPCVD           Nitide          1500 A      770 Deg. C
LTO             PSG             8000 A      420 Deg. C
PECVD           Oxide           20000 A     400 Deg. C
DC sputtred     Aluminium       6000 A      220 Deg. C


Sincerely yours

   RAJKUMAR
SCL, India


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