You can refer to the book "Fundamentals of Microfabrication" by Madou. Such technique is well explained in the book as well as in other literatures. Best, ShuTing Electrical Engineering, UCLA -----Original Message----- From: mems-talk-bounces+shuting=ucla.edu@memsnet.org [mailto:mems-talk-bounces+shuting=ucla.edu@memsnet.org] On Behalf Of Yilei Zhang Sent: Monday, July 14, 2003 10:37 AM To: mems-talk@memsnet.org Subject: [mems-talk] silicon trench wet etching Dear members: I have a question about silicon trench wet etching. If etched from back side, for example, 2um mask dimension, how wide the trench will be in the front side with wet etching? I know this depends on the orientation of wafer and the trench direction. According to the book, if the trench is aligned accurately, it is possible to get a vertical side wall, thus, the width in front side will be the same as that in back side, say, 2um. I donot know whether it requires very high accuracy to alignment in order to get vertical side wall. If I do the alignment manualy, generally how thin i can get in the front side? Is there anybody has experience in this area? thanks. Regards, Yilei Zhang _______________________________________________ MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk Hosted by the MEMS Exchange, providers of MEMS processing services. Visit us at http://www.memsnet.org/