Dear Administrator, Below is my question to mems-talk. please post it. I am trying to deposit NiCr pattern to PDMS. PDMS is spun on the Si wafer. At first, I tried to lift-off after pattern PR on PDMS, but PR has cracks when baking due to thermal mismatch (my quess) between Si and PR. So, I changed to the way that I deposit metal first then PR spinning and patterning, and NiCr etching using NiCr etchant. However, when I deposit NiCr on PDMS by using sputtering, there are serious cracks on metal. I don't know how I can solve this problem. I appreciate any comments and expertises. Thanks. Sincerely, --------------------------------------------------------- Byunghoon Bae Visiting scholar Mechanical & Industrial Engineering Univesity of Illinois at Urbana-Champaign 26 MEB MC-244 1206 W. Green St. Urbana, IL 61801 Tel: 1-217-244-7301, Fax: 1-217-244-6534 E-mail: bhbae@uiuc.edu Ph. D. candidate Dept. of Mechatronics Kwangju Inst. of Science and Technology(K-JIST) ¸¶À½¼ö·Ãȸ ȸ¿ø Member of mind(maum) meditation center -¸¶À½Àº Çϳª, ¸¶À½Àº ¸ðµç °Í Âü³ª¸¦ ã¾Æ, ¼ø¸®ÀÇ ®À»- -Mind is one, mind is everything Taking the path toward the truthful life- Mind meditation center: Korean: http://www.maum.org English: http://211.47.66.148/eng/ Japanese: http://www.kokolo.org