I have done the following: Ion mill the sapphire surface to ensure cleanliness. Ion-mill deposit chromium as an adhesion layer (~200 A). Ion-mill deposit nickel as an solderable layer (~1000 A). Ion-mill deposit gold as an wetting layer (~200 A). This was all done without breaking vacuum I then soldered to this metallization, heating to about 250 C. I saw no adhesion problems. Kirt Williams, Ph.D. consultant ----- Original Message ----- From: Mark FullerTo: General MEMS discussion Sent: Wednesday, August 13, 2003 10:52 AM Subject: [mems-talk] Adhesion layer for sapphire? > I am trying to get a good bond between Indium and sapphire. > I am currently using sputtered Ti as an adhesion layer. > The adhesion layer is failing in a following thermal cycle. > Any suggestions as to what would work better? > > -- > Mark Fuller > Microelectronics Fabrication Facility > Washington State University > Dana Hall 102 > Pullman, WA 99164-2711 > (509)335-1797 > > _______________________________________________ > MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list > options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk > Hosted by the MEMS Exchange, providers of MEMS processing services. > Visit us at http://www.memsnet.org/