Dear,

Does anyone know some commercial companies which are running an autoplating
process of 3-5 µm Ni and 0.1 µm Au bumps on Al bonding pads. A fast
delivery time (< 2 weeks) is very important.

Best regards,

Edvard Kälvesten, Ph.D.
Department of Signals, Sensors and Systems
Royal Institute of Tehnology
SE-10044 Stockholm, Sweden
Phone: +46 8 7907783
Fax: +46 8 100858
E-mail: edvard@s3.kth.se
http://www.s3.kth.se/instrlab