Michael, According to my CRC Handbook of Metal Etchants, boiling aqua regia will remove platinum but I don't know how the resist will handle it. (Saito, R et al - J. Electrochem Soc. 132, 224, 1985) You could also try molten sulfur or hot sulfur vapors, also mentioned as attacking platinum, but I wouldn't recommend it. Good luck! -Reid > >>>>>>----*----<<<<<< Start of Forwarded Message >>>>>>----*----<<<<<< >Dear all, > >is there anyone, who has worked on structuring platinum with wet >etchants? I have tried aqua-regia (3parts HCl, 1part HNO3) of 36 %, >but could not remove any Pt from my wafers. I am using ordinary >resist on top of the Pt for structuring. > >Any suggestions on aqua regia or other chemicals that could etch >Pt are greatly appreciated. > >Regards, > >Michael >================================================== >| Michael Koch | >| University of Southampton | >| Department of Electronics and Computer Science | >| Southampton SO17 1BJ | >| England | >| | >| Tel.: +44 (0)1703 593737 | >| Fax.: +44 (0)1703 593029 | >| email: M.Koch@soton.ac.uk | >================================================== > > -- .______________________________________________________________________. |Reid (Turtle) Alyn Brennen Hewlett-Packard Laboratories| |rbrennen@hpl.hp.com Chemical Systems Department | |(650) 857-4469 office 3500 Deer Creek Road, MS 26U| |(650) 852-8502 Fax Palo Alto, CA 94303-0867 | `