durusmail: mems-talk: RE: Pyrex 7740 wafers and glass-glass bonding
RE: Pyrex 7740 wafers and glass-glass bonding
RE: Pyrex 7740 wafers and glass-glass bonding
Carsten Wesselkamp
2003-09-01
Dear BALGOVIND, Dear Sooje Cho,

Plan Optik GmbH in Germany is producing glass wafers for anodic bonding and
can supply a lot of sizes from stock (e.g. 4" x 500 microns). Please tell me
the details regarding the size you need (diameter and thickness).

Plan Optik does also produce glass wafers with a special surface treatment
which are suitable for glass-glass bonding without any intermediate layer.

Best regards,

Carsten Wesselkamp

Plan Optik GmbH
Unter den Eichen
56479 Elsoff
Germany

Tel.: +49-2664-5068-25
Fax: +49-2664-5068-91



-----Original Message-----
From: mems-talk-bounces+c.wesselkamp=planoptik.com@memsnet.org
[mailto:mems-talk-bounces+c.wesselkamp=planoptik.com@memsnet.org]On
Behalf Of mems-talk-request@memsnet.org
Sent: Friday, August 29, 2003 3:53 PM
To: mems-talk@memsnet.org
Subject: MEMS-talk Digest, Vol 10, Issue 35


Send MEMS-talk mailing list submissions to
        mems-talk@memsnet.org

To subscribe or unsubscribe via the World Wide Web, visit
        http://mail.mems-exchange.org/mailman/listinfo/mems-talk
or, via email, send a message with subject or body 'help' to
        mems-talk-request@memsnet.org

You can reach the person managing the list at
        mems-talk-owner@memsnet.org

------------------------------

Message: 2
Date: Thu, 28 Aug 2003 15:56:46 +0530
From: "balgovind.iitkgp" 
Subject: [mems-talk] help needed
To: "General MEMS discussion"
Message-ID: <200308281040.QAA22773@WS0005.indiatimes.com>
Content-Type: text/plain; charset=us-ascii


Hello Everybody


!
    Please help in following regards



    1) I would like to know the process parameters(temperature and
concentration of etchants) and the etchants required for etching 500 micron
hole through normal glass and pyrex 7740. The masking layer will be
Cr/AU.
    2) Vendors for pyrex 7740, who can deliver some 30 pieces of pyrex
7740 at earliest. I'm based in India.
    3) The kind of (quality and quantity) of work I should do on anodic
bonding and glass etching to get an IEEE paper published



    Thanking in advance to those who reply.



    with warm regards to all



    BALGOVIND

------------------------------

Message: 5
Date: Thu, 28 Aug 2003 22:42:23 +0900
From: "Sooje Cho" 
Subject: [mems-talk] Glass-Glass thermal fusion bonding
To: 
Message-ID: <000601c36d6a$38cbd7f0$0100a8c0@MEMSware1>
Content-Type: text/plain;       charset="us-ascii"

The glasses are bonded generally at elevated temperature.
The temperature is varied by the glass composition.
General sodalime glass is bonded at the temperature of 500C-600C.
The surface of glass must be polished finely to get good bonding.
Vacuum annealing(heating) has good effects in case your glass is not
polished.

Sooje Cho from MEMSware






reply