How can I improve the adhesion of the Ti-Pt-Au metallization to GaAs
substrate? Ti adheres very well to substrates that have oxygen as one of
the components in the substrate, but obviously this is not the case with
GaAs.

Can I oxidize the GaAs substrate to improve the adhesion? If yes, what
impact will it have on the contact resistance?

Thanks very much in advance for your replies.

SK