Transene Company offers etchants for W and Cu which will not attack BST. Unfortunately, separate etchants will be required for the two metals. Please visit our website www.transene.com or contact me directly for more information. Christopher Christuk Transene Company Tel: 978 777 7860 Email: Christopher@transene.com -----Original Message----- From: Dipankar Ghosh [mailto:d.ghosh@lycos.com] Sent: Tuesday, September 09, 2003 2:46 PM To: mems-talk@memsnet.org Subject: [mems-talk] W /Cu etchant and Cu lift off Hello everyone , I am trying to find some suitable etchant for W and Cu .It should etch Cu and W but not BST(Barium strontium titanate) .Can anybody share his/ her experience in this regard. Also I am trying to do some lift off of 0.2 micron thick Cu(using negative PR) on BST/Alumina substrate. This process works well for BST/Si but not for BST/Alumina.( my alumina substrate is much rougher than Si wafer) how important does the surface roughness play a role in lift off process? Any answers / leads will be very much appreciated. Thanks Dipankar Ghosh OFFICE ADDRESS :- MATERIALS RESEARCH CENTER, ROOM 322 , RB-1, 1001 CAPABILITY DRIVE, CENTENNIAL CAMPUS, NCSU, RALEIGH , NC 27695-7919 USA PH- 919 515 5049 FAX- 919 515 3419 ____________________________________________________________ Get advanced SPAM filtering on Webmail or POP Mail ... Get Lycos Mail! http://login.mail.lycos.com/r/referral?aid=27005