Ryan, My first thought is that the oxide from the aluminum is getting in the way. Even for silicon-Pyrex anodic bonding, excessive oxide can block the bonding process. With Aluminum, it is even worse, since Al forms oxide so quickly. My best recommendation would be to perform an oxide removal immediately prior to bonding. For best results, you should also perform the bonding process itself in reducing atmosphere (such as forming gas). Best Regards, Chad Brubaker EV Group invent * innovate * implement Technology - Tel: (602) 437-9492, Fax: (602)437-9435 e-mail: C.Brubaker@EVGroup.com, www.EVGroup.com This message and any attachments contain confidential or privileged information, which is intended for the named addressee(s) only. If you have received it in error, please notify the sender immediately and then delete this e-mail. Please note that unauthorized review, copying, disclosing, distributing or otherwise making use of the information is strictly prohibited. -----Original Message----- From: rpooran@uark.edu [mailto:rpooran@uark.edu] Sent: Thursday, September 18, 2003 8:51 AM To: mems-talk@memsnet.org Subject: [mems-talk] Al-pyrex anodic bonding Hello all, i am interested in developing Al-pyrex anodic bonding. I have performed several experiments using thin film aluminum and pyrex glass and have been only successful a few times. i have not been able to make my process highly repeatable. I would appreciate advice from anyone who has had experience with this process. Regards. Ryan Ryan D. Pooran Ph.D Candidate Microelectronics-Photonics Mechanical Engineering Department University of Arkansas Fayetteville, AR 72701 Ph:479-575-4150 Fax: 479-575-6982 e-mail: rpooran@uark.edu _______________________________________________ MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk Hosted by the MEMS Exchange, providers of MEMS processing services. Visit us at http://www.memsnet.org/