durusmail: mems-talk: Vacuum packaging for Sensor devices
How to etch gold ( 3 micron thick0
2003-09-25
Vacuum packaging for Sensor devices
2003-09-26
2003-09-26
Vacuum packaging for Sensor devices
Absara Micro Systems
2003-09-28
Hi All,
Absara Micro Systems have developed a new vacuum package with following
features:
Low cost, Low Temperature, High Throughput, Very Reliable, Vacuum Levels
(currently <10 milli torr), High packaging yield.
Gautham V; ABSARA MiCRO SYSTEMS(S) PTE LTD
e-mail: absara@singnet.com.sg; website: www.absaramicro.com





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