Hi! I had a question about the susceptibility of parylene to the chemicals TMAH (tetra methyl ammonium hydroxide) & BOE (buffered oxide etch : HF+H2O +NH4F). Parylene was deposited in hollow silicon molds & needs to be released by etching away the silicon & some intermediate silicon dioxide. Need to know if the chemicals would attack the exposed parylene in the process of etching silicon. Kindly respond. - Asma --------------------------------- Do you Yahoo!? The New Yahoo! Shopping - with improved product search