----------
Fra: robert lyness[SMTP:rlyness9@IDT.NET]
Sendt: 6. november 1997 01:27
Ti&l: MEMS@ISI.EDU
E&mne: Re: platinum wet etching

Reid Alyn Brennen wrote:
>
> Michael,
>
> According to my CRC Handbook of Metal Etchants, boiling aqua regia
> will remove platinum but I don't know how the resist will handle it.
> (Saito, R et al - J. Electrochem Soc. 132, 224, 1985)
>
> You could also try molten sulfur or hot sulfur vapors, also mentioned
> as attacking platinum, but I wouldn't recommend it.
>
> Good luck!
>
> -Reid
>
> >
>
> >>>>>>----*----<<<<<< Start of Forwarded Message >>>>>>----*----<<<<<<
> >Dear all,
> >
> >is there anyone, who has worked on structuring platinum with wet
> >etchants? I have tried aqua-regia (3parts HCl, 1part HNO3) of 36 %,
> >but could not remove any Pt from my wafers. I am using ordinary
> >resist on top of the Pt for structuring.
> >
> >Any suggestions on aqua regia or other chemicals that could etch
> >Pt are greatly appreciated.
> >
> >Regards,
> >
> >Michael
> >==================================================
> >| Michael Koch                                   |
> >| University of Southampton                      |
> >| Department of Electronics and Computer Science |
> >| Southampton SO17 1BJ                           |
> >| England                                        |
> >|                                                |
> >| Tel.: +44 (0)1703 593737                       |
> >| Fax.: +44 (0)1703 593029                       |
> >| email: M.Koch@soton.ac.uk                      |
> >==================================================
> >
> >
>
> --
> .______________________________________________________________________.
> |Reid (Turtle) Alyn Brennen                Hewlett-Packard Laboratories|
> |rbrennen@hpl.hp.com                       Chemical Systems Department |
> |(650) 857-4469 office                     3500 Deer Creek Road, MS 26U|
> |(650) 852-8502 Fax                        Palo Alto, CA 94303-0867    |
> `