HI Rob, YOu can try dipping it into dilute H2SO4 for ~15sec, then you will see the shiny surface of copper seed layer. HOpe it helps:> Linda:) On Thu, 9 Oct 2003, Rob Davis wrote: > Date: Thu, 9 Oct 2003 13:29:13 -0400 > From: Rob Davis> To: mems-talk@memsnet.org, mems-talk@memsnet.org, mems-talk@memsnet.org > Subject: [mems-talk] Copper Electroplate > > Greetings all, need advice. How to minimize flash oxidation of electroplated copper, are there any tricks or passivation agents? > > Thanks > Rob Davis > Caldus Semiconductor > RobDavis@CaldusSemi.com > > _______________________________________________ > MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list > options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk > Hosted by the MEMS Exchange, providers of MEMS processing services. > Visit us at http://www.memsnet.org/ >