Dear Sam, Although we are not situated in the silicon valley area, we do have long time experience with trough wafer via hole etching of 4" and 6" wafers using the DRIE-Bosch Process on our Alcatel 601E etchers. Feel free to contact me directly or visit our homepage for more information on our MEMS foundry services. Best regards, Joern _______________________________________________________________________________ Jörn Koblitz Sales and Customer Support microFAB Bremen GmbH Universitaetsallee 5 D-28359 Bremen, Germany phone: +49 421 24 100 24 fax: +49 421 24 100 99 email: koblitz@microfab.de web: www.microfab.de _______________________________________________________________________________ > -----Ursprüngliche Nachricht----- > Von: Sam Beal [mailto:sambeal@pacbell.net] > Bereitgestellt: Mittwoch, 1. Oktober 2003 18:45 > Bereitgestellt in: MEMS-talk > Unterhaltung: [mems-talk] DRIE for through wafer openings > Betreff: [mems-talk] DRIE for through wafer openings > > > Hi > I am lookng for DRIE services, preferrably in silicon valley. > > I have an integrated circuit application requiring an array > of large, deep openings. > Specically I have 6" wafers. I would like to create an array > of vias 300um (or more) deep. Each via is 400um (or more) > diameter and a wafer could contain 10,000 or more. > > Sam Beal > JigSawtek > San Jose, CA > _______________________________________________ > MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list > options, visit > http://mail.mems-exchange.org/mailman/listinfo/mems-talk > Hosted by the MEMS Exchange, providers of MEMS processing services. > Visit us at http://www.memsnet.org/ >