Hi there,


I am research student from UKM, Malaysia. Now i try to
use RF magnetron sputtering to deposit Pt films on
substrate Si/SiO2, using target from Kurt J.Lesker
Company (1 inch diameter, 3mm thickness).

However, the results are so poor. The Pt films seem to
be oxidized, with low conductivity and poor adhesion
to substrate. The ferroelectric ceramic thin films,
which i deposited on Pt films, become conductive. It
seems like there is diffusion between the
ferroelectric layer and Pt films or there are other
reasons?

May i know why was this happened? Below are the
parameters i use for Pt deposition:

Base vaccum: 2 x 10-6 to 1 x 10-5 mbar
Substrate temperature: room temperature
Gas: Pure Ar
Sputtering gas: 1 x 10-2 mbar
Power: 40W

Thanks a lot!

from,
Chong Cheong Wei
Faculty of Science and Technology,
Physics department,
Thin Films Lab,


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