Dear members,

 I am a Ph.D. student from the Polytechnic University of Madrid,
 working on the design of satellite microwave circuits using chips.

 I would like to know if there are problems with the utilization of
 wire bondings over glass PTFE substrates for spatial applications.

 Your response to this and any relating information will be
 appreciated,

 Thank you in advance,

 Manuel Sierra
 E.T.S.I Telecomunicacion
 Ciudad Universitaria
 28040 MADRID
 SPAIN

 e-mail: manol@gr.ssr.upm.es
Manuel Sierra Castaner
Grupo de Radiacion
E.T.S.I.T. Madrid