Dear MEMS researchers,

I'm Seong-Hyok Kim working in Korea. I tried to fabricate a silicon
structure by using SOI bulk micromachining, but I'm suffering from some
problems during DRIE etch-through.

At first, I used thick PR to bond a main wafer to handle wafer indirectly,
and softbaked it. However, the results was not so good. The uniformity was
bad, and the wall profile was not so good. Unfortunately, we could not
seperate the bonded wafer easily.

I've heard that a kind of thermal conductive epoxy can be used for bonding
the wafers And the main wafer which is epoxy-bonded to the handle wafer
could be released by using DRIE process. Also, someone said that the
epoxy-bonded wafer could be easily detached from the other wafer by using
acetone only !

Could anyone help me find such kind of thermal conductive epoxy ?
Or, could anyone recommend bonding materials and bonding-methods to be used
for etch-through DRIE ?

Thank you very much in advance.

Seong-Hyok Kim