Hi All, I have a layout design of the metal (gold) lines connecting the sensor to the outside and I wish to place bond pads on the periphery of the sensor die. However, I have no experience in the wire bonding area. Could anyone that has knowledge in this area suggest the dimensions and thickness of the bond pads I should have? And if the thickness of the bond pads is different than that of conducting lines, that means I need to have an extra mask just to define the pads?? Thanks you, Tom