Hello,

I am looking for a compliant material that can be integrated into a
released MEMS device.  The basic concept is a cantilevered beam where the
gap under the beam is filled with a soft, low modulus of elasticity
material.  This would allow the beam to deflect without providing an area
underneath for contamination to accumulate.  I suppose the material can
be deposited and etched before the structural layer is deposited over it,
or the cantilever can be formed, released, and then the compliant
material integrated afterwards.  Any ideas would be appreciated.

Dan