_______________________________________________________________________________ To: Daniel Pruzan; mems group From: KlemicJ on Mon, Apr 21, 1997 8:19 AM Subject: RE: Compliant material Daniel Pruzan, How about a putting a flexible membrane over it instead? John Klemic _______________________________________________________________________________ To: MEMS@ISI.EDU From: Daniel Pruzan on Sat, Apr 19, 1997 12:30 AM Subject: Compliant material RFC Header:Received: by starbase1.caltech.edu with SMTP;19 Apr 1997 00:29:57 -0700 Received: by darkstar.isi.edu (5.65c/5.61+local-24) id; Fri, 18 Apr 1997 17:45:47 -0700 Received: from venera.isi.edu by darkstar.isi.edu (5.65c/5.61+local-24) id ; Fri, 18 Apr 1997 17:45:45 -0700 Received: from darkstar.isi.edu by venera.isi.edu (5.65c/5.61+local-26) id ; Fri, 18 Apr 1997 17:45:44 -0700 Received: by darkstar.isi.edu (5.65c/5.61+local-24) id ; Fri, 18 Apr 1997 17:45:43 -0700 Message-Id: <199704190045.AA16303@darkstar.isi.edu> Date: Fri, 04 Apr 1997 13:52:50 -0500 From: Daniel Pruzan Subject: Compliant material To: MEMS@ISI.EDU X-Url: http://mems.isi.edu/mems.html Reply-To: Daniel Pruzan Hello, I am looking for a compliant material that can be integrated into a released MEMS device. The basic concept is a cantilevered beam where the gap under the beam is filled with a soft, low modulus of elasticity material. This would allow the beam to deflect without providing an area underneath for contamination to accumulate. I suppose the material can be deposited and etched before the structural layer is deposited over it, or the cantilever can be formed, released, and then the compliant material integrated afterwards. Any ideas would be appreciated. Dan