Does anyone have actual etch rate data for various recipes? I don't have numbers available right now, but my past experience using the ASE process in STS etchers is that nitride and Si etch at essentially the same rate, while any oxide is much much slower. In fairness, the nitride films in my experiments were always pretty thin, and I never tried very hard to calculate an exact etch rate for them. My point however is that nitride is not a good stopping layer, nor will exposed nitride features survive very well, in an SF6 silicon etch. BTW- the rate of oxides is highly dependent on the densification, so CVD oxide etches faster than thermal oxide for example. Hope these comments help... Marc Straub Solidus Technologies, Inc. Colorado Springs, CO USA -----Original Message----- From: Brent Garber [mailto:garber@engr.uconn.edu] Sent: Friday, April 02, 2004 2:59 PM To: General MEMS discussion Subject: Re: [mems-talk] SF6 isotropic etch Yao, The Si02 and Si3N4 will etch much, much, slower than the Si in SF6, but uit will etch them all. Brent Qing Yao wrote: > Hi, > > I need to do SF6 isotropic dry etch of single crystal Si. I was wondering if > Silicon Nitride and Silicon Dioxide will also be etched in this process. If > so, does SF6 has good selectivity to them? I heard that people can use > Silicon Nitride or Silicon Dioxide as mask in BOSCH process (DRIE). So I > guess SF6 does have good selectivity to them. But I am not sure. Please let > me know if you have any information about this. Thanks! > > Best Regards, > > Qing Yao > ___________________ > M&IE @ UIUC > > _______________________________________________ > MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list > options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk > Hosted by the MEMS Exchange, providers of MEMS processing services. > Visit us at http://www.memsnet.org/