Chuan Seng, With response to your questions below: 1) It is recommended that the wafers be chemically cleaned prior to the activation. Standard cleans such as Piranha and RCA 1 & 2 (SC1 & 2) are sufficient, although any HF dip steps associated with these cleans should be left out, of course , since the HF may roughen the oxide surface. You may even want to look into application of megasonics for the rinse prior to plasma activation to ensure good particle removal, as for any direct bonding process, particles are the enemy. 2) DI rinse is not necessary after activation. Of course, I can only speak for the systems EVG manufactures, as there will be variance between the operational methods of other systems. 3) Power, Temperature, and duration can be specific to the substrate being processed (such as size, features, bow/warp, etc), although typically the post bonding temperature will not exceed 300 C. Activation and bonding are performed at room temperature. Best Regards, Chad Brubaker EV Group invent * innovate * implement Technology - Tel: (602) 437-9492, Fax: (602)437-9435 e-mail: C.Brubaker@EVGroup.com, www.EVGroup.com This message and any attachments contain confidential or privileged information, which is intended for the named addressee(s) only. If you have received it in error, please notify the sender immediately and then delete this e-mail. Please note that unauthorized review, copying, disclosing, distributing or otherwise making use of the information is strictly prohibited. -----Original Message----- From: mems-talk-bounces+c.brubaker=evgroup.com@memsnet.org [mailto:mems-talk- bounces+c.brubaker=evgroup.com@memsnet.org] On Behalf Of Tan, Chuan Seng Sent: Thursday, May 20, 2004 8:27 AM To: mems-talk@memsnet.org Subject: [mems-talk] Plasma activation for Wafer Bonding Hello ! Does anyone have any experience with plasma activation in oxide wafer bonding ? (1) do we need to chemically clean the wafers prior to plasma activation ? (2) do we need to rinse and dry the wafers after plasma activation ? (3) how about power, temperature and duration ? Appreciate your inputs ! Chuan Seng _______________________________________________ MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk Hosted by the MEMS Exchange, providers of MEMS processing services. Visit us at http://www.memsnet.org/