Dear all,

after looking through the archive I can't seem to find a direct answer to my
particular problem. I'm trying to plate up to 0.9um through shipley 1813 resist
but am having the seemingly common problem of underplating and even a breaking
off of the resist in the areas around the plated regions during the subsequent
rinse.

The substrate is glass with a silver seed layer and the process as follows:

cleaning and dehydration of glass (150 C for 30 mins)
thermal evaporation of silver to ~300nm
dehydration of sample (150 C for 30 mins)
application of S1813 at 3000 rpm
bake at 100 C for 1 min
exposure
development
hardbake at 120 C for 5 mins

electoplating using PURAMET 402 (pH 7.5, 55 C, 1mA/cm^2, 15 mins)
rinse

Thanks,

Novak


_____________________________________

Novak Farrington
Institute of Microwaves and Photonics
School of Electronic and Electrical Engineering
University of Leeds
Leeds LS2 9JT
UK

Mob. 0790 9948673
Fax. +44 (0)113 343 7265
email: eennf@leeds.ac.uk