Hi all,
I have some difficulties in RuO2 films deposition by sputtering on
different substrates like SiO2 and SiNx low stress. When the thickness is
more than 120 nm, the film peel off on SiNx. I tried different clean
methods (RCA, pirahna, with or without HF dip), but finally after few days,
the films peel off. Is anyone got the same difficulties ?
Thank you.
Philippe Combette