durusmail: mems-talk: SU8-developpement problems
SU8-developpement problems
SU8-developpement problems
Brubaker Chad
2004-12-02
Laetita,

You mention that you have considerable swelling of your polymer after exposure.
At what point after exposure? After the post-exposure bake? Or after the
develop?

100% swelling is very unusual.  It may be that you performed an insufficient
curing step (either on soft bake, or during the post exposure bake) that allowed
absorption of developer solvent into the exposed region.  It may also indicate
an insufficient exposure, such that the cross-link process is incomplete, again
leading to absorption of the solvent.

The lift-off that you are observing is making me lean towards under-exposure as
an issue.  My reasoning is as follows:

1) If the issue is under exposure, the upper layers of the resist will have
received the greatest dose (since it absorbs some of the energy that would
otherwise penetrate), promoting cross-link in the upper portions. However, the
lower regions would still be under dose, so that cross-linking does not complete
(or may barely occur at all). During develop, these areas will be attacked and
dissolved by the developer.

2) If, instead, the issue were an insufficient post exposure bake, assuming you
are using a contact hot-plate, the greatest amount of heating (and cross-
linking) would occur close to the wafer surface.  Then, you would see a height
loss in your features, but no lift-off.

Of course, the possibility also remains that you are performing an insufficient
processing in all categories (bake, exposure).  Some tips:

- If you are using the process parameters from the data sheets on MicroChem's
website (at www.microchem.com), make sure that your bakes are performed on a
hotplate.

- The exposure dose information is for intensities measured at I-line (365 nm).
SU-8 is only sensitive to radiation with wavelengths below 400nm (thus, it is
transparent to g-line - 435nm - and h-line - 405nm).  In addition, it is highly
sensitive (to a prohibitive degree) to radiation below 350nm.  So, best results
are achieved either by exposing only at 365nm, or, exposing with a broadband
source that includes I-line (360 - 450, for instance).  However, it is very
critical that you base your dose on an intensity measured at I-line, since the
corresponding intensities at the other bands will be different (although
proportional), and will lead to an incorrect exposure.

Best Regards,
Chad Brubaker

EV Group       invent * innovate * implement
Technology - Tel:  480.727.9635, Fax:  480.727.9700  e-mail:
c.brubaker@EVGroup.com, www.EVGroup.com

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 -----Original Message-----
From:   mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org]  On
Behalf Of laetitia philippe
Sent:   Thursday, December 02, 2004 7:40 AM
To:     mems-talk@memsnet.org
Subject:        [mems-talk] SU8-developpement problems

 Hello All,
I am using the SU-8 2035 for making film thicknesses of 50 microns.

I am proceeding with the soft and hard bake in a normal way. After my exposure I
can see clearly that around the structure I have considerable swelling of my
polymer, around 100% of my original thickness. SOmetimes the polymer sticks
well, sometimes it delaminates from its region

Also, the structure I expose is somewhat always minored in dimensions in
comparison of my original mask.

Has someone ever encountered this problem?

Is it due to a wrong exposure time (I am using a UV source , 365 nm), 7 to 9
seconds?
Is it due to a bad curing? maybe should be longer to reduce


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