Adhesion problem with electroplated metal layers (Au or Ag) Hello all, We experience problems with the electroplating of Au (thickness of about 5 microns) on oxidized Si-wafers (100) with structured Cr/Au seed layer (10 nm and 30 nm, resp.). The front surface features an 8x16 array of edge-connected squares of 10 mm2 area. The back side is coated with Cr only. So far, the produced metallic structure easily flakes off from the SiO2 substrate during or after the electroplating process (ORIMA B, Schlötter GmbH, PH 4.2). Separated flakes and the edges of surviving metal patches bends outwards. Furthermore, the layered metal foil is quite brittle. Tests with Ag instead of Au showed similar problems. Could someone tell me what probably went wrong and how we can fix these problems? Regards Michael Kobusch michael.kobusch@ptb.de