Hi,

  Plating of In on Au indeed gives very good results. For uniformity, you
may try to use a pulsed power source (ON/OFF ratio 1:6), filter the
electrolyte continuously, use a stirrer to maintain uniformity of the
electrolyte and prevent the formation of the interfacial micro bubbles, use
a low enough current for plating and may also use mechanical polishing for
planarization. You may refer to the following paper for further reading

"Jongpil Cheong, Abhijat Goyal, Srinivas Tadigadadpa, and Christopher Rahn,
"Reliable bonding using indium-based solders", Proc. SPIE Int. Soc. Opt.
Eng. 5343, 114 (2004)"

Abhijat