Neil,

Please describe your bonding technique using "flowable organosilane".
I'm looking for a method of bonding wafers with an intermediate layer
that will survive KOH and TMAH etch.

Roger Shile

-----Original Message-----
Does anyone know of any improved methids for wafer bonding than may have
been previously discussed?
I am familiar with the use of a spin on bonding method using a flowable
organosilane, any other better techniques.