>Does anyone have experience of dicing sapphire wafers using a wafer saw.
>If so, I would appreciate information on what saw blades to use and the
>cutting conditions.
>
>Joseph Cefai
>

Joseph -

I don't know if this will help in the UK, but we use a MicroAutomation 1006
dicing saw with Resinoid blades (54RU7, 0.008 inch kerf) from Thermocarbon
Inc (407-834-7800).

We do progressive cuts of 0.005 inch per cut. This particular Resinoid
blade has a slightly larger diamond grit for use with sapphire.

I hope that helps,

Jim Beall
beall@boulder.nist.gov