Dear All,
I am fabricating gold electrode on the glass wafer with the thickness of
20um. When I remove the seedlayer (gold and Ti-W)after electroplating,, I
found the surface of the gold become dark yellow and lost the metallic
luster.There is a layer of powder on the surface of the gold electrode
after wet etching in the I2+KI+H2O bath and it can be easily scape by the
tweezer.Does anyone find this before and know how to remove this powder(on
the surface and the sidewall).
Thanks and Regards
H.Q.