Deposit thin Ti first, then Au. After that, do plating. Good luck. Li >From: "Krishna Vummidi">Subject: [mems-talk] reg: electroplaing on 5214 > >Im trying to electroplate(Au) on patterned resist (AZ 5214-IR). The problem >i think, im facing is the resist adhesion on Au. Is it normal or does the >electrolyte (from transene - SG-10) attacks 5214. would HMDS improve >adhesion and help to electroplate?