Hi, I am trying to release my double clamped cantilever beams after
KOH etch. I etch my SOI wafer from bottom with KOH, then attach it
onto a support wafer using S1813 and do RIE from top. I put device
with its supprt wafer in Acetone for 1-2hours in order to make sure
device is fully detached from the support wafer. However, when I try
to take the sample from acetone, beams are broken.

Do you have any ideas, suggestions?

Thanks,

Tolga