Try with ~10-15 nm Ti.  Good luck,

Giuliano

xiaodong wang wrote:

>Hi, All,
>
>When I deposit 110 nm Cr to porous low-K(170nm  thick
>SiCOH) material by E-Beam evaporation, Cr layer was
>cracked due to stress.
>
>I wonder if there is adhesion promoter which can help
>reduce the stress and achieve no crack in Cr film.
>
>Does anyone has the experience with this?