Dwayne, What do you mean, exactly, when you mention placing "sensitive surfaces"? In one way, it sounds as if you are looking at placing some sort of non-polymer device, such as a CMOS or MEMS chip, onto a fabricated microfuidic device (PDMS, COC, polycarbonate, PMMA). Depending on the arrangement you wish to do this in, a couple of approaches could be taken: 1) Large scale (similar to wafer scale) - traditional wafer-level bonding process: There has been quite a bit of work done with bonding of polymers to silicon, GaAs, and other substrate materials. 2) Small device - large scale (Chip-to-wafer): One adaptation that has been nade recently has been the concept of combining a chip-mounting system with a wafer bonding system. The chip-mount handles the placement of discrete items onto a wafer-scale substrate (perhaps your microfuidic device), while the bonding system has adaptive pressure application, allowing for uniform bonding of asymmetrically placed die. A setup such as this was developed in conjunction between DataCON and EVG. 3) Small device - small device - in this case, the approach would again be similar to the wafer - to - wafer approach. Best Regards, Chad Brubaker -----Original Message----- From: Dwayne Dunaway Sent: Friday, October 28, 2005 10:46 PM To: mems-talk@memsnet.org Subject: [mems-talk] attaching surfaces to devices Does anyone have any suggestions on how to attach sensitive surfaces to microfluidic devices fabricated out of plastic or polymers?