yes. But You have to use Some metal as adhesive (seed
layer) inorder to fix electrodes..by metallization.,

Generally chromium is better..or Titanium.,

Then You can deposit the metal you want by
metallization..

Regards.,

Balasubramanian
Mcmaster university.


--- trinadh allaka  wrote:

> Hai all
>
> I am designing a capacitive acceleromete. My
> question is can I use metal
> layer as the interconnect to fixed electrodes and to
> feed excitation? Which
> metal layer is preferred?
>
> My fab flow is
>  wafer definition
> Deposit silicon nitride
> Deposit metal
> etch metal
> Deposit silicon dioxide
> etch siO2
> deposit polysilicon
> etch poly
> sacrifice  siO2
>