Aarti,
      Your explanation is not clear to me.  Is the hole in the glass
wafer for the anodic bonding only.  If so you could consider plasma
bonding.  If you plasma clean the faces that need to be glued together,
you raise the bonds on the surface that are then looking for similar
bonds.  Then press the faces together and you get intimate gluing of
face to face without any glue.  Contact me directly for more
information.


Bill Moffat, CEO
Yield Engineering Systems, Inc.
2185 Oakland Rd., San Jose, CA  95131
(408) 954-8353