Miscut angle is normally the slicing orientation angle off the main orientation of the material. I am assuming the the reference to miscut of 0.1 degree is actually the tolerance listed by the manufacturer with the crystal actually being cut ON orientation ( 1-1-0 in this case) A miscut of +_0.1 degree is as tight as any slicing operation can cut and verify on their saws and Xray system and only a few manufacturers can even meet this level of accuracy. There are tolerances within the slicing process as well as tolerances in the measuring equipment that must be considered in the manufacturing cycle. You might want to talk with the manufacturer to see if they can guarantee a tighter slicing tolerance, but I would doubt it could be done better than +_0.1 degree. Once the wafer is sliced , there is no way to change this orientation tolerance... Ken Smith Kmbh Technologies ( aka Associates) Phone-510-714-5055 fax 510 217-4421 email kasmith2@ix.netcom.com Supplier of Specialty High Purity Float Zone and CZ Silicon wafers, SOI, Glass and other semiconductor and Optical materials and services. Duan wrote: > what do you exactly mean by saying miscut angle? > > On 4/27/06, Andrea Mazzolariwrote: > >> I have (110) silicon waferds with a miscut angle of 0.1°. Is there a >> way to >> reduce miscut angle? Can an etching in TMAH help? >