Hi all

Is there any researcher who have used KMPR1050(MicroChem) negative PR?
The vender recommended me KMPR1050 will be stripped perfectly in SU-8
remover PG at 70 oC for 30min.
However in my experiment KMPR1050 residue is remained after strip process.
I'm not sure the problems are in fabrication process or strip process.

My process condition is following.(Thickness : 120um)
- PR coating (120um)
- Soft bake : 30min at 65oC, 150min 95oC (oven)
- exposure : 1500 mJ/cm^2
- P.E.B : 15min at 65oC, 45min 95oC (oven)
- development : 10min in TMAH 2.38wt%
- (no hard bake)
- Ni electroplating
- PR strip

Any answers about KMPR1050 strip are welcomed.

Best Regards,
Jeong Im Deok