Guys., I electroplated Ni on Gold/Cr/Si (gold is seed layer). But after few hrs.,Nickel adhesion is lost and gets peeled off. I suppose this is due to the stress initiated during Ni electrodeposition. When viewing under microscope, The top surface of Peeled Ni is rough., Bottom surface is very smooth. Whether increasing the roughness of seed layer either by plasma oxidation technique will help???. Thanks Bala.