Hi all. I need to etch through a (110) silicon wafer 500um thick. I'm
planning to use TMAH. Will walls be perfectly vertical ? If not, which
etchant could i use ? In case of tmah etch will under etch responsible for
not vertical walls ?
Based on what i know, walls will not be perfectly vertical, this sould be
due to under etch... i'm i wrong ?
Could someone suggest me some article on this argument ?

Thanks!
Andrea