Dear Cindi:

I am interested in the Au and Al deposition processes. How can I obtain the
process information and the material for the process?
Thanks
Wen Ko


Dear Mark & Mems Friends,
>I have a suggestion that may help with many of
>your formulations.
>We are currently developing an electroless process
>for depositing conductors onto ceramics and metal
>using our nanopowders as well as away of laser
>bonding them. We manufacture energetic nanosize
>metal powders that can readily bond to metal and
>ceramic substrates. The powders have a metastable
>structure and undergo morphological transformation
>at relatively low temperatures, releasing heat and
>creating fresh surfaces.   When the powders
>exotherm, they are very reactive with substrates
>and under appropriate conditions, they will form
>adherent coatings.  We have been able to bond
>several conductors to alumina and glass and with
>the collaboration of Sandia National Laboratory,
>we have been able to deposit conductive copper
>patterns onto glass with a resolution of about 10
>microns.
>Aluminum has been successfully bonded onto silicon
>wafers with excellent ohmic contact.
>
>
>Cindi Prorok - R & D
>Argonide Corporation
>info@argonide.com
>http://www.argonide.com
>
>