Hello

I’m going to deposit two metal tracks one of Au and one of Ag over a
quartz
wafer (using evaporation and in a lift-off process). I need an adhesion
layer which I’m going to use Ti. Also I need a diffusion barrier (to avoid
corrosion) which I’m in doubt whether Ni is better or Pd (Palladium).
Can anyone help me whether (Ti/Ni/Ag, Ti/Ni/Au) is better or (Ti/Pd/Ag,
Ti/Pd/Au)?

Another question is: if I want to deposit a layer of platinum (Pt), do I
need a diffusion barrier layer such Ni or Pd?
I’m asking this because Pt can itself be used as a diffusion barrier layer
(similar to Ni and Pd).

Bests,