Hi, Can't you just spin photoresist as the passivation layer? It would be very uniform and can be patterned. Tseng-Yang Hsu Integrated Micromachines yang@micromachines.com -----Original Message----- From: Mounir EnnabiTo: MEMS@ISI.EDU Date: Thursday, April 02, 1998 5:31 PM Subject: dielectric passivation for interconnects? >Dear group members >Has anybody experience with dielectric passivation. I would like to >cover homogeneously two metal interconnects with a dielectric layer in >order to isolate them from the surrounding humid environment. These >interconnects will be used in MCM's for through holes applications. >The interconnects are 5mum high, and PECVD-oxide doesn't offer a good >stepcoverage. I have tried evaporated glass without good results. >This dielectric layer has to be patterned in order to open contact holes >to the metallines. So materials like Parylene (a polymer)is out of >question (difficult to etch). >Does anybody have a ready-to-use solution? > > regards.Mounir. > >Mikroelektronik Centret, building 345, room 154 >Technical University of Denmark, DK-2800 Lyngby. > > >