Dear all,

I am fabricating some free-standing MEMs devices based on SOI wafer. Now I
need to cut the chips into individul devices to do some measurements. The
problem is that the structure is so fragile that when cutting it using
scriber and breaking it with hands the whole structure collapses. Could
anyone who has been faced with the same problem please give me any
suggestions? Thanks very much.


--
Xiang Zhou
PhD candidate
Semiconductor Physics Group
Cavendish Laboratory
University of Cambridge