Hi all.

I am making a mold for electroplating Cu with SU-8 2015 on the glass wafer.

Until developing process, it looks there is no problem(SU-8 looks strongly
adhered to the glass wafer).

But when I electroplate Cu, the SU-8 mold layer is perfectly peeled off.

Do you have any idea why this happens?

Does SU-8 have adhesion problem with glass wafer?


Thank you.

aeroalto
aeroalto@tamu.edu