For good thickness., you need to electroplate. For good control over thickness (less thickness),u can do either sputtering or evaporation. For electroplating.,Ti or Cr Seed layer should be either sputtered or evaporated. Sputtering by e-beam should be better than thermal evaporation as temp can be higher in the evaporation. Regards Bala --- madhav raowrote: > Hi all, > I am planning to deposit Nickel on silicon > wafer. However im using PMMA patterning. Hence i > need > to do liftoff. Can u suggest a simpler way of > depositing nickel such as sputtering or evaporation > or > electroplating. Let me know!!